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ZSSC3135BA1D

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Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

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ZSSC3135BA1D

Active
Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationZSSC3135BA1D
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Pricing

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DistributorPackageQuantity$
DigikeyTray 100$ 7.23

Description

General part information

ZSSC3135 Series

The ZSSC3135 is a member of the ZSSC313x product family of CMOS integrated circuits designed for automotive and industrial sensor applications. All family members are well suited for highly accurate amplification and sensor-specific correction of resistive bridge sensor signals. An internal 16-bit RISC microcontroller running a correction algorithm compensates sensor offset, sensitivity, temperature drift, and nonlinearity of the connected sensor element. The required calibration coefficients are stored by the single-pass calibration procedure in an on-chip EEPROM. The ZSSC3135 is specially designed for piezoresistive bridge sensor elements. The amplification stage with an analog gain of 105 in combination with the optional temperature compensation using an external temperature sensor fits the requirements of piezoresistive sensor applications perfectly.

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