48-3554-16

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Aries Electronics

48P DIP NICKEL BORON BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

48P DIP NICKEL BORON BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	48-3554-16

Contact Finish - Mating	Nickel Boron
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Mating	1.27 µm
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Post	1.27 µm
Contact Finish Thickness - Post	50 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	48
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Material - Mating	Type	Type	Type	Housing Material	Termination Post Length	Termination Post Length	Features	Number of Positions or Pins (Grid)	Mounting Type	Material Flammability Rating	Termination	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3554-10	Tin	5.08 µm	200 µin	1 A	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Closed Frame	48	Through Hole	UL94 V-0	Solder	Beryllium Copper	200 µin	5.08 µm	0.1 in	2.54 mm	2.54 mm	0.1 in
Aries Electronics 48-3554-16	Nickel Boron	1.27 µm	50 µin	1 A	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Closed Frame	48	Through Hole	UL94 V-0	Solder	Beryllium Copper	50 µin	1.27 µm	0.1 in	2.54 mm	2.54 mm	0.1 in	Nickel Boron
Aries Electronics 48-3554-18	Nickel Boron	1.27 µm	50 µin	1 A	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyetheretherketone (PEEK) Glass Filled	0.11 in	2.78 mm	Closed Frame	48	Through Hole	UL94 V-0	Solder	Beryllium Nickel	50 µin	1.27 µm	0.1 in	2.54 mm	2.54 mm	0.1 in	Nickel Boron	-55 °C	250 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

48 (2 x 24) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole

Technical documentation and resources