70-1903-0810
ActiveKester Solder
SOLDER 500G JAR,SN96.5 AG3.0
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70-1903-0810
ActiveKester Solder
SOLDER 500G JAR,SN96.5 AG3.0
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 70-1903-0810 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | Water Soluble |
| Form | Jar |
| Form | 17.64 oz, 500 g |
| Melting Point [Max] | 218 °C |
| Melting Point [Max] | 424 °F |
| Melting Point [Min] | 217 °C |
| Melting Point [Min] | 423 °F |
| Mesh Type | 3 |
| Shelf Life | 4 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Storage/Refrigeration Temperature [Max] | 50 °F |
| Storage/Refrigeration Temperature [Max] | 10 °C |
| Storage/Refrigeration Temperature [Min] | 0 °C |
| Storage/Refrigeration Temperature [Min] | 0 °C |
| Type | Solder Paste |
| Weight | 1.1 lbs |
| Weight | 499 g |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 249.81 | |
| 5 | $ 214.89 | |||
| 10 | $ 201.32 | |||
| 30 | $ 181.47 | |||
| 50 | $ 172.87 | |||
Description
General part information
70-1903 Series
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Documents
Technical documentation and resources