W25R256JWPIQ

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Winbond Electronics

IC FLASH 256MBIT SPI 8WSON

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Winbond Electronics

IC FLASH 256MBIT SPI 8WSON

Technical Specifications

Parameters and characteristics for this part

Part	Memory Organization	Write Cycle Time - Word, Page	Memory Type	Package / Case	Clock Frequency	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Size	Memory Interface	Mounting Type	Technology	Supplier Device Package	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]
Winbond Electronics W25R256JVEIQ	32 M	3 ms	Non-Volatile	8-WDFN Exposed Pad	133 MHz	2.7 V	3.6 V	256 Gbit	SPI - Quad I/O	Surface Mount	FLASH - NOR	8-WSON (8x6)	FLASH	85 °C	-40 °C
Winbond Electronics W25R256JWEIQ TR	32 M		Non-Volatile	8-WDFN Exposed Pad	104 MHz	1.7 V	1.95 V	256 Gbit	SPI	Surface Mount	FLASH - NOR	8-WSON (8x6)	FLASH	85 °C	-40 °C
Winbond Electronics W25R256JWPIQ	32 M		Non-Volatile	8-WDFN Exposed Pad	104 MHz	1.7 V	1.95 V	256 Gbit	SPI	Surface Mount	FLASH - NOR	8-WSON (6x5)	FLASH	85 °C	-40 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

FLASH - NOR Memory IC 256Mbit SPI 104 MHz 8-WSON (6x5)

Technical documentation and resources