HSE-B500-04H

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CUI Devices

HEATSINK: EXTRUDED; H; TO220; BLACK; L: 50MM; W: 35MM; H: 25.4MM

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CUI Devices

HEATSINK: EXTRUDED; H; TO220; BLACK; L: 50MM; W: 35MM; H: 25.4MM

Technical Specifications

Parameters and characteristics for this part

Specification	HSE-B500-04H

Attachment Method	PC Pin, Bolt On
Fin Height	1 in
Fin Height	25.4 mm
Length [x]	1.969 in
Length [x]	50 mm
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	TO-220
Power Dissipation @ Temperature Rise	75 °C, 12.2 W
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	200 LFM, 2.88 °C/W
Thermal Resistance @ Natural	8.05 °C/W
Type	Board Level, Vertical
Width	35 mm
Width [x]	1.378 in

Part	Fin Height	Fin Height	Type	Thermal Resistance @ Forced Air Flow	Package Cooled	Power Dissipation @ Temperature Rise	Material Finish	Length [x]	Length [x]	Thermal Resistance @ Natural	Shape	Attachment Method	Material	Width [x]	Width
CUI Devices HSE-B500-04H	1 in	25.4 mm	Board Level Vertical	2.88 °C/W 200 LFM	TO-220	12.2 W 75 °C	Black Anodized	1.969 in	50 mm	8.05 °C/W	Rectangular Fins	Bolt On PC Pin	Aluminum Alloy	1.378 in	35 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1350	$ 1.24

General part information

Heat Sink TO-220 Aluminum Alloy 12.2W @ 75°C Board Level, Vertical

Technical documentation and resources