96-208M50

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Aries Electronics

SOCKET ADAPTER QFP TO 208PGA

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Active

Aries Electronics

SOCKET ADAPTER QFP TO 208PGA

Technical Specifications

Parameters and characteristics for this part

Specification	96-208M50

Board Material	FR4 Epoxy Glass
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Copper
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	QFP
Convert To (Adapter End)	PGA
Mounting Type	Through Hole
Number of Pins	208
Pitch - Mating	0.02 in
Pitch - Mating	0.5 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in

Part	Pitch - Mating	Pitch - Mating	Convert From (Adapter End)	Termination	Termination Post Length	Termination Post Length	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Board Material	Contact Finish - Post	Number of Pins	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating
Aries Electronics 96-208M50	0.02 in	0.5 mm	QFP	Solder	3.18 mm	0.125 in	Through Hole	2.54 mm	0.1 in	Brass	FR4 Epoxy Glass	Tin-Lead	208	PGA	200 µin	5.08 µm	Copper

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

IC Socket Adapter QFP To PGA Through Hole

Technical documentation and resources