UPD70F3824GB-GAH-AX

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Renesas Electronics Corporation

IC MCU 32BIT 256KB FLASH 64LQFP

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DocumentsDatasheet V850ES/JG3-H, V850ES/JH3-H User's Manual: Hardware

UPD70F3824GB-GAH-AX

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Renesas Electronics Corporation

IC MCU 32BIT 256KB FLASH 64LQFP

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DocumentsDatasheet V850ES/JG3-H, V850ES/JH3-H User's Manual: Hardware

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3824GB-GAH-AX

Connectivity	I2C, USB, CSI, UART/USART, EBI/EMI, CANbus
Core Processor	V850ES
Core Size	32-Bit Single-Core
Data Converters	D/A 1x8b, A/D 10x10b
Mounting Type	Surface Mount
Number of I/O	45
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	64-LQFP
Peripherals	WDT, DMA, LVD, PWM
Program Memory Size	256 KB
Program Memory Type	FLASH
RAM Size	24 K
Speed	48 MHz
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	2.85 V

V850ES/Jx3-H Series

32-bit Microcontrollers

Part	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Package / Case	Program Memory Size	Number of I/O	Core Processor	Program Memory Type	Supplier Device Package	Speed	Peripherals	RAM Size	Operating Temperature [Max]	Operating Temperature [Min]	Oscillator Type	Data Converters	Connectivity	Core Size	Mounting Type	Data Converters [custom]	Data Converters [custom]	Data Converters [custom]	Data Converters [custom]
Renesas Electronics Corporation UPD70F3824GB(S)-GAH-AX	3.6 V	2.85 V	64-LQFP	256 KB	45	V850ES	FLASH	64-LFQFP (10x10)	48 MHz	DMA LVD PWM WDT	24 K	85 °C	-40 °C	Internal	A/D 10x10b SAR D/A 1x8b	CSI EBI/EMI I2C UART/USART USB	32-Bit	Surface Mount
Renesas Electronics Corporation UPD70F3761GC-UEU-AX	3.6 V	2.85 V	100-LQFP	384 KB	77	V850ES	FLASH		48 MHz	DMA LVD PWM WDT		85 °C	-40 °C	Internal		CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount	2	12	10 b	8 b
Renesas Electronics Corporation UPD70F3824GB-GAH-AX	3.6 V	2.85 V	64-LQFP	256 KB	45	V850ES	FLASH		48 MHz	DMA LVD PWM WDT	24 K	85 °C	-40 °C	Internal	A/D 10x10b D/A 1x8b	CANbus CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount
Renesas Electronics Corporation UPD70F3816GA-GAM-AX	3.6 V	2.85 V	48-LQFP	64 KB	32	V850ES	FLASH		48 MHz	DMA LVD PWM WDT	24 K	85 °C	-40 °C	Internal	A/D 6x10b D/A 1x8b	CANbus CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount
Renesas Electronics Corporation UPD70F3766GF-GAT-AX	3.6 V	2.85 V	128-LQFP	384 KB	96	V850ES	FLASH		48 MHz	DMA LVD PWM WDT		85 °C	-40 °C	Internal		CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount	2	12	10 b	8 b
Renesas Electronics Corporation UPD70F3767GF-GAT-AX	3.6 V	2.85 V	128-LQFP	512 KB	96	V850ES	FLASH		48 MHz	DMA LVD PWM WDT	56 K	85 °C	-40 °C	Internal		CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount	2	12	10 b	8 b
Renesas Electronics Corporation UPD70F3770GC-UEU-AX	3.6 V	2.85 V	100-LQFP	256 KB	77	V850ES	FLASH		48 MHz	DMA LVD PWM WDT	40 K	85 °C	-40 °C	Internal		CANbus CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount	2	12	10 b	8 b
Renesas Electronics Corporation UPD70F3765GF-GAT-AX	3.6 V	2.85 V	128-LQFP	256 KB	96	V850ES	FLASH		48 MHz	DMA LVD PWM WDT	40 K	85 °C	-40 °C	Internal		CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount	2	12	10 b	8 b
Renesas Electronics Corporation UPD70F3762GC-UEU-AX	3.6 V	2.85 V	100-LQFP	512 KB	77	V850ES	FLASH		48 MHz	DMA LVD PWM WDT	56 K	85 °C	-40 °C	Internal		CSI EBI/EMI I2C UART/USART USB	32-Bit Single-Core	Surface Mount	2	12	10 b	8 b

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

V850ES/Jx3-H Series

The new 32-bit V850ES/Jx3-H MCUs execute USB 2.0 data transfers at full speeds up to 12 megabits per second (Mbps), and enable rapid development of applications that require USB connectivity and 32-bit processing power for real-time control of industrial equipment, factory automation systems, point-of-sales terminals, medical and testing devices, telecommunications and consumer electronics products and other embedded applications.