HSE-B18635-035H-04

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CUI Devices

HEATSINK: EXTRUDED; H; TO218; BLACK; L: 63.5MM; W: 41.6MM; H: 25MM

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CUI Devices

HEATSINK: EXTRUDED; H; TO218; BLACK; L: 63.5MM; W: 41.6MM; H: 25MM

Technical Specifications

Parameters and characteristics for this part

Specification	HSE-B18635-035H-04

Attachment Method	Clip, PC Pin
Fin Height	0.984 in
Fin Height	25 mm
Length [x]	63.5 mm
Length [x]	2.5 in
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	TO-218
Power Dissipation @ Temperature Rise	75 °C, 15.1 W
Shape	Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow	2.38 °C/W, 200 LFM
Thermal Resistance @ Natural	4.97 °C/W
Type	Board Level, Vertical
Width [x]	1.638 in
Width [x]	41.6 mm

Part	Power Dissipation @ Temperature Rise	Material	Thermal Resistance @ Natural	Attachment Method	Shape	Material Finish	Package Cooled	Thermal Resistance @ Forced Air Flow	Type	Length [x]	Length [x]	Width [y]	Width [y]	Fin Height	Fin Height	Width [x]	Width [x]
CUI Devices HSE-B18635-0396H	13.7 W	Aluminum Alloy	5.47 °C/W	Bolt On PC Pin	Rectangular Angled Fins	Black Anodized	TO-218	2.78 °C/W	Board Level Vertical	63.5 mm	2.5 in	42 mm	1.654 in	0.984 in	25 mm
CUI Devices HSE-B18635-035H-04	15.1 W 75 °C	Aluminum Alloy	4.97 °C/W	Clip PC Pin	Rectangular Angled Fins	Black Anodized	TO-218	2.38 °C/W 200 LFM	Board Level Vertical	63.5 mm	2.5 in			0.984 in	25 mm	1.638 in	41.6 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1200	$ 1.37

General part information

Heat Sink TO-218 Aluminum Alloy 15.1W @ 75°C Board Level, Vertical

Technical documentation and resources