212-1-24-006

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CnC Tech, LLC

CONN IC DIP SOCKET 24POS GOLD

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CnC Tech, LLC

CONN IC DIP SOCKET 24POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	212-1-24-006

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	4 mOhm
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polybutylene Terephthalate (PBT)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	24
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Contact Finish - Post	Mounting Type	Type	Type	Type	Contact Material - Post [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Resistance	Housing Material	Pitch - Mating	Pitch - Mating	Features	Termination	Number of Positions or Pins (Grid)	Contact Finish - Mating
CnC Tech, LLC 212-1-24-006	Tin	Surface Mount	DIP	0.6 in	15.24 mm	Brass	-40 °C	105 ░C	Beryllium Copper	3 A	2.54 mm	0.1 in	UL94 V-0	200 µin	5.08 µm	4 mOhm	Polybutylene Terephthalate (PBT)	0.1 in	2.54 mm	Open Frame	Solder	24	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	2000	$ 2.93

General part information

24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount

Technical documentation and resources