3B02
Obsolete3B SERIES 8 CHANNEL BACKPLANE
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3B02
Obsolete3B SERIES 8 CHANNEL BACKPLANE
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Technical Specifications
Parameters and characteristics for this part
| Specification | 3B02 |
|---|---|
| null | |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 3 | $ 112.67 | |
Description
General part information
3B02 Series
To address diverse applications, the 3B Subsystem Series was designed to provide a complete signal conditioning solution. The 3B02 is designed for 8 channels to offer users the flexibility to match the size of a system to specific applications. All backplanes are provided with #6-32 x 1-inch screws and standoffs for mounting. Several mounting options are available, including rack, surface and NEMA enclosure.All 3B Series modules feature a universal pin out and can be easily tailored to fit the user's application. Each backplane can accommodate any 3B Series module in a "Mix and Match" arrangement. Modules are "Hot Swappable"; power does not have to be removed when inserting or removing any module on the backplane. All backplanes provide a four screw terminal for each individual channel's input field connections. These connections satisfy all transducer inputs and provide transducer excitation when necessary. A cold junction temperature sensor is also supplied on each channel to accommodate thermocouple input modules. Each channel has two screw terminals for the output connections for the 4-20 mA output signal. Two 26-pin system connectors provide high level voltage I/O for all channels.
Documents
Technical documentation and resources