HDG104-DN-2

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H&D Wireless AB

IC RF TXRX+MCU WIFI 44QFN

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H&D Wireless AB

IC RF TXRX+MCU WIFI 44QFN

Technical Specifications

Parameters and characteristics for this part

Specification	HDG104-DN-2

Current - Receiving	60 mA
Current - Transmitting	15 mA
Data Rate (Max) [Max]	54 Mbps
Frequency	2.4 GHz
Memory Size	1 kB, 160 kB
Modulation	OFDM, DQPSK, BPSK, DSSS, DBPSK, QPSK, 16QAM, 64QAM, CCK
Mounting Type	Surface Mount
Operating Temperature [Max]	70 °C
Operating Temperature [Min]	-20 C
Package / Case	44-LQFN Exposed Pad Module
Power - Output	17 dBm
Protocol	802.11b/g
RF Family/Standard	WiFi
Serial Interfaces	SPI, SDIO, UART
Supplier Device Package	44-QFN SIP (7.7x7.1)
Type	TxRx + MCU
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.75 V

Part	RF Family/Standard	Package / Case	Protocol	Serial Interfaces	Frequency	Current - Transmitting	Voltage - Supply [Min]	Voltage - Supply [Max]	Modulation	Memory Size	Data Rate (Max) [Max]	Mounting Type	Power - Output	Type	Current - Receiving	Supplier Device Package	Operating Temperature [Min]	Operating Temperature [Max]
H&D Wireless AB HDG104-DN-2	WiFi	44-LQFN Exposed Pad Module	802.11b/g	SDIO SPI UART	2.4 GHz	15 mA	2.75 V	3.6 V	16QAM 64QAM BPSK CCK DBPSK DQPSK DSSS OFDM QPSK	1 kB 160 kB	54 Mbps	Surface Mount	17 dBm	TxRx + MCU	60 mA	44-QFN SIP (7.7x7.1)	-20 C	70 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

IC RF TxRx + MCU WiFi 802.11b/g 2.4GHz 44-LQFN Exposed Pad Module

Technical documentation and resources