SMD291SNL50T6
ActiveChip Quik Inc.
SOLDER PASTE IN JAR 50G (T6) SAC
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SMD291SNL50T6
ActiveChip Quik Inc.
SOLDER PASTE IN JAR 50G (T6) SAC
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SMD291SNL50T6 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | No-Clean |
| Form | Jar |
| Form | 1.76 oz |
| Form | 50 g |
| Melting Point [Max] [custom] | 428 °F |
| Melting Point [Max] [custom] | 220 °C |
| Melting Point [Min] [custom] | 217 °C |
| Melting Point [Min] [custom] | 422 °F |
| Mesh Type | 6 |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 99.95 | |
Description
General part information
SMD291 Series
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Documents
Technical documentation and resources