BDN10-3CB/A01

Active

Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.01"SQ

Search across all available documentation for this part.

Active

Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.01"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN10-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length	25.65 mm
Length	1.01 "
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	8 °C/W
Thermal Resistance @ Natural	26.4 °C/W
Type	Top Mount
Width [x]	25.65 mm
Width [x]	1.01 in

Part	Material	Thermal Resistance @ Natural	Length	Length	Width [x]	Width [x]	Shape	Thermal Resistance @ Forced Air Flow	Fin Height	Fin Height	Package Cooled	Type	Attachment Method	Material Finish	Shelf Life
Tusonix a Subsidiary of CTS Electronic Components BDN10-3CB/A01	Aluminum	26.4 °C/W	25.65 mm	1.01 "	25.65 mm	1.01 in	Pin Fins Square	8 °C/W	9.02 mm	0.355 in	ASIC BGA CPU LGA	Top Mount	Thermal Tape Adhesive (Included)	Black Anodized	24 Months
Tusonix a Subsidiary of CTS Electronic Components BDN10-5CB/A01	Aluminum	20.8 °C/W	25.65 mm	1.01 "	25.65 mm	1.01 in	Pin Fins Square	6.3 °C/W 400 LFM	14.1 mm	0.555 in	ASIC BGA CPU LGA	Top Mount	Thermal Tape Adhesive (Included)	Black Anodized	24 Months

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources