Zenode.ai Logo
Beta
K

26-0518-10H

Active
Aries Electronics

CONN SOCKET SIP 26POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

26-0518-10H

Active
Aries Electronics

CONN SOCKET SIP 26POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification26-0518-10H
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)26
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
TypeSIP

26-0518 Series

PartPitch - MatingPitch - MatingContact Finish Thickness - MatingContact Finish Thickness - MatingContact Material - MatingContact Material - Post [custom]TerminationTypeMaterial Flammability RatingFeaturesContact Finish - MatingHousing MaterialContact Finish - PostMounting TypeCurrent Rating (Amps)Pitch - PostPitch - PostTermination Post LengthTermination Post LengthNumber of Positions or Pins (Grid)Contact Finish Thickness - PostContact Finish Thickness - PostTermination Post Length [x]Termination Post Length [x]
Aries Electronics
0.1 in
2.54 mm
10 çin
0.25 çm
Beryllium Copper
Brass
Solder
SIP
UL94 V-0
Open Frame
Gold
Glass Filled
Nylon 4/6
Polyamide (PA46)
Gold
Through Hole
3 A
2.54 mm
0.1 in
3.18 mm
0.125 in
26
10 çin
0.25 çm
Aries Electronics
0.1 in
2.54 mm
10 çin
0.25 çm
Beryllium Copper
Brass
Solder
SIP
UL94 V-0
Open Frame
Gold
Glass Filled
Nylon 4/6
Polyamide (PA46)
Tin
Through Hole
3 A
2.54 mm
0.1 in
3.18 mm
0.125 in
26
200 µin
5.08 µm
Aries Electronics
0.1 in
2.54 mm
10 çin
0.25 çm
Beryllium Copper
Brass
Solder
SIP
UL94 V-0
Open Frame
Gold
Glass Filled
Nylon 4/6
Polyamide (PA46)
Tin
Through Hole
3 A
2.54 mm
0.1 in
3.18 mm
0.125 in
26
200 µin
5.08 µm
Aries Electronics
0.1 in
2.54 mm
10 çin
0.25 çm
Beryllium Copper
Brass
Solder
SIP
UL94 V-0
Open Frame
Gold
Glass Filled
Nylon 4/6
Polyamide (PA46)
Tin
Surface Mount
3 A
2.54 mm
0.1 in
26
200 µin
5.08 µm
0.046 in
1.17 mm
Aries Electronics
0.1 in
2.54 mm
10 çin
0.25 çm
Beryllium Copper
Brass
Solder
SIP
UL94 V-0
Open Frame
Gold
Glass Filled
Nylon 4/6
Polyamide (PA46)
Tin
Through Hole
3 A
2.54 mm
0.1 in
3.18 mm
0.125 in
26
200 µin
5.08 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 175$ 2.89

Description

General part information

26-0518 Series

26 (1 x 26) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources