SMD4300LTLFP250T4

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Chip Quik Inc.

SOLDER PASTE SN42/BI57.6/AG0.4

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Active

Chip Quik Inc.

SOLDER PASTE SN42/BI57.6/AG0.4

Technical Specifications

Parameters and characteristics for this part

Specification	SMD4300LTLFP250T4

Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Flux Type	Water Soluble, No-Clean
Form	Jar, 8.8 oz (250g)
Melting Point [custom]	138 °C
Melting Point [custom]	280 °F
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature [Max]	77 °F
Storage/Refrigeration Temperature [Min]	0 °C
Type	Solder Paste

Part	Shelf Life Start	Shipping Info	Shelf Life	Type	Flux Type	Form	Form	Process	Melting Point [custom]	Melting Point [custom]	Mesh Type [custom]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Composition
Chip Quik Inc. SMD4300AX500T4C	Date of Manufacture	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	12 Months	Solder Paste	No-Clean Water Soluble	17.64 oz 500 g	Cartridge	Leaded	361 °F	183 °C	4
Chip Quik Inc. SMD4300LTLFP250T4	Date of Manufacture		6 Months	Solder Paste	No-Clean Water Soluble		Jar 8.8 oz (250g)		280 °F	138 °C		77 °F	0 °C	Bi57.6Sn42Ag0.4 (57.6/42/0.4)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean, Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

Technical documentation and resources

No documents available