SPC5775EDK3MME3
ActiveFreescale Semiconductor - NXP
MCU 32-BIT E200Z7 RISC 4MB FLASH 5V 416-PIN MAP-BGA TRAY AUTOMOTIVE AEC-Q100
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SPC5775EDK3MME3
ActiveFreescale Semiconductor - NXP
MCU 32-BIT E200Z7 RISC 4MB FLASH 5V 416-PIN MAP-BGA TRAY AUTOMOTIVE AEC-Q100
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Technical Specifications
Parameters and characteristics for this part
| Specification | SPC5775EDK3MME3 |
|---|---|
| Connectivity | SCI, FlexCANbus, SPI, EBI/EMI, Ethernet, LINbus, CANbus |
| Core Processor | e200z7 |
| Core Size [custom] | 32-Bit Dual-Core |
| Mounting Type | Surface Mount |
| Number of I/O | 293 I/O |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | External |
| Package / Case | 416-BGA |
| Program Memory Size | 4 MB |
| Program Memory Type | FLASH |
| RAM Size | 512 K |
| Speed | 264 MHz |
| Supplier Device Package | 416-MAPBGA (27x27) |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 3 V |
SPC5775 Series
| Part | Package / Case | Mounting Type | Supplier Device Package | Operating Temperature [Min] | Operating Temperature [Max] | Number of I/O | Program Memory Size | Speed | Program Memory Type | Oscillator Type | RAM Size | Core Processor | Core Size [custom] | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Connectivity | Peripherals |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 416-BGA | Surface Mount | 416-MAPBGA (27x27) | -40 °C | 125 °C | 293 I/O | 4 MB | 264 MHz | FLASH | External | 512 K | e200z7 | 32-Bit Dual-Core | 5.5 V | 3 V | CANbus EBI/EMI Ethernet FlexCANbus LINbus SCI SPI | |
Freescale Semiconductor - NXP | 416-BGA | Surface Mount | 416-MAPBGA (27x27) | -40 °C | 125 °C | 4 MB | 220 MHz | FLASH | Internal | 512 K | e200z7 | 32-Bit Dual-Core | 5.5 V | 3 V | CANbus EBI/EMI Ethernet FlexRay LINbus PSI SPI UART/USART | ||
Freescale Semiconductor - NXP | |||||||||||||||||
Freescale Semiconductor - NXP | 416-BGA | Surface Mount | 416-MAPBGA (27x27) | -40 °C | 125 °C | 4 MB | 220 MHz | FLASH | External | 512 K | e200z7 | 32-Bit Dual-Core | 5.5 V | 3 V | CANbus EBI/EMI Ethernet FlexCAN LINbus SCI SPI | DMA LVD POR | |
Freescale Semiconductor - NXP | 416-BGA | Surface Mount | 416-MAPBGA (27x27) | -40 °C | 125 °C | 293 I/O | 4 MB | 220 MHz | FLASH | External | 512 K | e200z7 | 32-Bit Dual-Core | 5.5 V | 3 V | CANbus EBI/EMI Ethernet FlexCANbus LINbus SCI SPI | |
Freescale Semiconductor - NXP | |||||||||||||||||
Freescale Semiconductor - NXP | |||||||||||||||||
Freescale Semiconductor - NXP | |||||||||||||||||
Freescale Semiconductor - NXP | 416-BGA | Surface Mount | 416-MAPBGA (27x27) | -40 °C | 125 °C | 4 MB | 220 MHz | FLASH | External | 512 K | e200z7 | 32-Bit Dual-Core | 5.5 V | 3 V | CANbus EBI/EMI Ethernet FlexCAN LINbus SCI SPI | DMA LVD POR | |
Freescale Semiconductor - NXP |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
SPC5775 Series
2 x power architecture z7 cores, timer/PWM: 2x eMIOS, 32ch total/3x eTPU, 96ch total
4000KB flash, 512KB RAM and
264MHz max operating frequency and automotive flow
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Technical documentation and resources