STK551U3A2AGEVB

Obsolete

ON Semiconductor

EVALUATION BOARD FOR STK551U3A2A INTELLIGENT POWER MODULE

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STK551U3A2AGEVB

Obsolete

ON Semiconductor

EVALUATION BOARD FOR STK551U3A2A INTELLIGENT POWER MODULE

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	STK551U3A2AGEVB

Embedded	False
Function	Motor Controller/Driver
Supplied Contents	Board(s)
Type	Power Management
Utilized IC / Part	STK551U3A2A

STK551U3A2A-E Series

Intelligent Power Module (IPM), 600 V, 20 A

Part	Supplier Device Package	Output Configuration	Current - Peak Output	Load Type	Voltage - Load [Max]	Voltage - Supply [Min]	Voltage - Supply [Max]	Interface	Package / Case	Mounting Type	Fault Protection	Current - Output / Channel [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Technology	Applications	Features	Function	Utilized IC / Part	Supplied Contents	Type
ON Semiconductor STK551U3A2A-E	29-SIP	Half Bridge (3)	40 A	Inductive	450 V	12.5 V	17.5 V	Logic	29-SSIP Module 21 Leads Formed Leads	Through Hole	Current Limiting Shoot-Through UVLO	20 A	150 °C	-40 °C	IGBT	AC Motors	Bootstrap Circuit Latch Function Status Flag
ON Semiconductor STK551-391A-E
ON Semiconductor STK551U3A2AGEVB																		Motor Controller/Driver	STK551U3A2A	Board(s)	Power Management
ON Semiconductor STK551-3A0A1-E
ON Semiconductor STK551U392A-E	29-SIP	Half Bridge (3)	30 A	Inductive	450 V	12.5 V	17.5 V	Logic	29-SSIP Module 21 Leads Formed Leads	Through Hole	Current Limiting Shoot-Through UVLO	15 A	150 °C	-40 °C	IGBT	AC Motors	Bootstrap Circuit Latch Function Status Flag

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

STK551U3A2A-E Series

This Intelligent Power Module (IPM) is a highly integrated device containing all High Voltage (HV) control from HV-DC to 3-phase outputs in a single small SIP module. Output stage uses IGBT / FRD technology and implements Under Voltage Protection (UVP) and Over Current Protection (OCP). Internal Boost diodes are provided for high side gate boost drive.

Documents

Technical documentation and resources