XC2785X104F80LRABKXUMA1

Obsolete

Infineon Technologies

IC MCU 16/32B 832KB FLSH 144LQFP

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XC2785X104F80LRABKXUMA1

Obsolete

Infineon Technologies

IC MCU 16/32B 832KB FLSH 144LQFP

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	XC2785X104F80LRABKXUMA1

Connectivity	SSC, LINbus, CANbus, USI, EBI/EMI, SPI, UART/USART, I2C
Core Processor	C166SV2
Core Size [Max]	32 Bit
Core Size [Min]	16 Bit
Data Converters	10 b, 24
Mounting Type	Surface Mount
Number of I/O	116 I/O
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	144-LQFP Exposed Pad
Peripherals	WDT, I2S, PWM, POR
Program Memory Size	832 KB
Program Memory Type	FLASH
RAM Size	50 K
Speed	80 MHz
Supplier Device Package	PG-LQFP-144-4
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

XC2785 Series

Part	RAM Size	Operating Temperature [Min]	Operating Temperature [Max]	Connectivity	Program Memory Type	Core Size [Min]	Core Size [Max]	Mounting Type	Speed	Peripherals	Oscillator Type	Program Memory Size	Data Converters	Number of I/O	Supplier Device Package	Package / Case	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Core Processor
Infineon Technologies XC2785X104F80LRABKXUMA1	50 K	-40 °C	125 °C	CANbus EBI/EMI I2C LINbus SPI SSC UART/USART USI	FLASH	16 Bit	32 Bit	Surface Mount	80 MHz	I2S POR PWM WDT	Internal	832 KB	10 b 24	116 I/O	PG-LQFP-144-4	144-LQFP Exposed Pad	5.5 V	3 V	C166SV2

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

XC2785 Series

Equipped with advanced peripherals like multiple PWM-units, ﬂ exible serial interfaces (Universal Serial Interfaces (USICs)), as well as a MultiCAN unit with up to 2 CAN nodes, the microcon troller is the perfect fi t for value driven PowerTrain applications. External component integration such as an embedded voltage regulator, eePROM emulation with additio nal ﬂ ash modules and various on chip oscillators additionally optimizes total system costs.

Documents

Technical documentation and resources

No documents available