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BD30FC0WEFJ-E2 - 8-HTSOP-J

BD30FC0WEFJ-E2

Active
Rohm Semiconductor

1A 3V, FIXED OUTPUT, HIGH-ACCURACY LDO REGULATOR

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BD30FC0WEFJ-E2 - 8-HTSOP-J

BD30FC0WEFJ-E2

Active
Rohm Semiconductor

1A 3V, FIXED OUTPUT, HIGH-ACCURACY LDO REGULATOR

Technical Specifications

Parameters and characteristics for this part

SpecificationBD30FC0WEFJ-E2
Control FeaturesEnable
Current - Output1 A
Current - Quiescent (Iq)0.5 mA
Current - Supply (Max) [Max]2.5 mA
Mounting TypeSurface Mount
Number of Regulators1
Operating Temperature [Max]85 C
Operating Temperature [Min]-25 °C
Output ConfigurationPositive
Output Type1.81 mOhm
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Protection FeaturesSoft Start, Over Temperature, Over Current
Supplier Device Package8-HTSOP-J
Voltage - Input (Max) [Max]26.5 V
Voltage Dropout (Max) [Max]0.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.01
10$ 1.28
25$ 1.09
100$ 0.87
250$ 0.77
500$ 0.70
1000$ 0.65
Digi-Reel® 1$ 2.01
10$ 1.28
25$ 1.09
100$ 0.87
250$ 0.77
500$ 0.70
1000$ 0.65
Tape & Reel (TR) 2500$ 0.59
5000$ 0.56
7500$ 0.54
12500$ 0.52
17500$ 0.51

Description

General part information

BD30FC0WEFJ Series

BD30FC0WEFJis low-saturation regulators. The BDxxFC0WEFJ series output voltages are Variable, 3.0V, 3.3V, 5.0V, 6.0V, 7.0V, 8.0V, 9.0V, 10.0V, 12.0V, and 15.0V and package is HTSOP-J8. This series has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading.

Documents

Technical documentation and resources

BD30FC0WEFJ-E2 Flammability

Related Document

HTSOP-J8 Taping Spec

Datasheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation

Package Information

Power Source ON/OFF Characteristics for Linear Regulator

Schematic Design & Verification

Calculating Junction Temperature from Inrush Current

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter

Schematic Design & Verification

Connecting LDOs in Parallel

Schematic Design & Verification

Table of resistance for output voltage setting on linear regulator Ics

Schematic Design & Verification

HTSOP-J8 Package Information

Package Information

Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Basics of Linear Regulators

Schematic Design & Verification

EMC Measures for LDOs

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Problem Situations: Power Supply Does Not Start

Schematic Design & Verification

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Usage of SPICE Macromodel (for LDO)

Schematic Design & Verification

BDxxFC0 Series Dropout Voltage

Application Note

UL94 Flame Classifications of Mold Compound

Environmental Data

BDxxFC0 Series PCB Layout

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

BD30FC0WEFJ Data Sheet

Data Sheet

Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)

Schematic Design & Verification

Six Steps for Successful Thermal Design of LDO Regulator ICs

White Paper

Compliance with the ELV directive

Environmental Data

Factory Information

Manufacturing Data

Power Supply Sequence Circuit with General Purpose Power Supply IC

Schematic Design & Verification

Reverse Voltage Protection

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design