W978H2KBVX1E TR

Winbond Electronics

IC DRAM 256MBIT HSUL 12 134VFBGA

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Winbond Electronics

IC DRAM 256MBIT HSUL 12 134VFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Supplier Device Package	Supplier Device Package [x]	Supplier Device Package [y]	Operating Temperature [Min]	Operating Temperature [Max]	Memory Type	Package / Case	Write Cycle Time - Word, Page	Technology	Memory Organization	Memory Format	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Interface	Mounting Type	Memory Size	Clock Frequency	Access Time
Winbond Electronics W978H2KBVX2E	134-VFBGA	10	11.5	-25 °C	85 °C	Volatile	134-VFBGA	15 ns	SDRAM - Mobile LPDDR2	8M x 32	DRAM	1.14 V	1.95 V	Parallel	Surface Mount	256 Gbit	400 MHz
Winbond Electronics W978H2KBVX1E TR	134-VFBGA	10	11.5	-25 °C	85 °C	Volatile	134-VFBGA	15 ns	SDRAM - Mobile LPDDR2-S4B	8M x 32	DRAM	1.14 V 1.7 V	1.3 V 1.95 V	HSUL_12	Surface Mount	256 Gbit	533 MHz	5.5 ns
Winbond Electronics W978H2KBVX2I	134-VFBGA	10	11.5	-40 °C	85 °C	Volatile	134-VFBGA	15 ns	SDRAM - Mobile LPDDR2	8M x 32	DRAM	1.14 V	1.95 V	Parallel	Surface Mount	256 Gbit	400 MHz
Winbond Electronics W978H2KBVX1E	134-VFBGA	10	11.5	-25 °C	85 °C	Volatile	134-VFBGA	15 ns	SDRAM - Mobile LPDDR2-S4B	8M x 32	DRAM	1.14 V 1.7 V	1.3 V 1.95 V	HSUL_12	Surface Mount	256 Gbit	533 MHz	5.5 ns

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	3500	$ 4.03

General part information

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

Technical documentation and resources