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RSX051VYM30FHTR - TUMD2M

RSX051VYM30FHTR

Active
Rohm Semiconductor

SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 30 V, 500 MA, 390 MV, 5 A, 150 °C

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RSX051VYM30FHTR - TUMD2M

RSX051VYM30FHTR

Active
Rohm Semiconductor

SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 30 V, 500 MA, 390 MV, 5 A, 150 °C

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRSX051VYM30FHTR
Current - Average Rectified (Io)500 mA
Current - Reverse Leakage @ Vr200 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / Case2-SMD, Flat Leads
QualificationAEC-Q101
Reverse Recovery Time (trr)9.6 ns
Speed200 mA, 500 ns
Supplier Device PackageTUMD2M
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If [Max]390 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.38
10$ 0.27
100$ 0.13
500$ 0.11
1000$ 0.08
Digi-Reel® 1$ 0.38
10$ 0.27
100$ 0.13
500$ 0.11
1000$ 0.08
Tape & Reel (TR) 3000$ 0.07
6000$ 0.07
9000$ 0.06
30000$ 0.06
75000$ 0.05
150000$ 0.05

Description

General part information

RSX051VYM30FH Series

RSX051VYM30 is small mold type (TUMD2M) schottky barrier diode for general rectification.

Documents

Technical documentation and resources

TUMD2M TR Taping Spec

Datasheet

TUMD2M Part Marking

Related Document

AEC-Q101 Automotive Requirements

Related Document

Diode Flammability

Related Document

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Inner Structure

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Diode)

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

PCB Layout Thermal Design Guide

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Flammability of Materials

Environmental Data

Diode Types and Applications

Technical Article

What Is Thermal Design

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

Package Dimensions

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Taping Information

Package Information

About Export Regulations

Export Information