Zenode.ai Logo
Beta
K
XG8V-0331 - XG8V-0331

XG8V-0331

Active
Omron Electronics Inc-EMC Div

CONN HEADER VERT 3POS 2.54MM

Deep-Dive with AI

Search across all available documentation for this part.

XG8V-0331 - XG8V-0331

XG8V-0331

Active
Omron Electronics Inc-EMC Div

CONN HEADER VERT 3POS 2.54MM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationXG8V-0331
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.15 µm
Contact Finish Thickness - Mating5.9 µin
Contact Finish Thickness - Post0.15 µm
Contact Finish Thickness - Post5.9 µin
Contact Length - Mating6 mm
Contact Length - Mating0.236 in
Contact Length - Post0.118 in
Contact Length - Post3 mm
Contact MaterialBrass, Nickel
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)3 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height [z]0.098 in
Insulation Height [z]2.5 mm
Insulation MaterialPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions LoadedAll
Number of Rows1
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Overall Contact Length0.453 in
Overall Contact Length11.5 mm
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
ShroudingUnshrouded
StyleBoard to Board, Cable
TerminationSolder
Voltage Rating300 VDC

XG8V Series

PartVoltage RatingConnector TypeStyleContact MaterialMaterial Flammability RatingCurrent Rating (Amps)Insulation MaterialContact Finish Thickness - MatingContact Finish Thickness - MatingOverall Contact LengthOverall Contact LengthContact Length - MatingContact Length - MatingTerminationFastening TypeOperating Temperature [Max]Operating Temperature [Min]Contact Finish - MatingShroudingContact ShapePitch - MatingPitch - MatingContact Finish - PostInsulation Height [z]Insulation Height [z]Number of Positions LoadedContact TypeMounting TypeNumber of RowsContact Finish Thickness - PostContact Finish Thickness - PostContact Length - PostContact Length - PostInsulation ColorNumber of Positions
Omron Electronics Inc-EMC Div
300 VDC
Header
Board to Board
Cable
Brass
Nickel
UL94 V-0
3 A
Polybutylene Terephthalate (PBT)
Glass Filled
0.15 µm
5.9 µin
0.453 in
11.5 mm
6 mm
0.236 in
Solder
Push-Pull
105 ░C
-55 °C
Gold
Unshrouded
Square
0.1 in
2.54 mm
Gold
0.098 in
2.5 mm
All
Male Pin
Through Hole
1
0.15 µm
5.9 µin
0.118 in
3 mm
Black
Omron Electronics Inc-EMC Div
300 VDC
Header
Board to Board
Cable
Brass
Nickel
UL94 V-0
3 A
Polybutylene Terephthalate (PBT)
Glass Filled
0.15 µm
5.9 µin
0.453 in
11.5 mm
6 mm
0.236 in
Solder
Push-Pull
105 ░C
-55 °C
Gold
Unshrouded
Square
0.1 in
2.54 mm
Gold
0.098 in
2.5 mm
All
Male Pin
Through Hole
1
0.15 µm
5.9 µin
0.118 in
3 mm
Black
4
Omron Electronics Inc-EMC Div
300 VDC
Header
Board to Board
Cable
Brass
Nickel
UL94 V-0
3 A
Polybutylene Terephthalate (PBT)
Glass Filled
0.15 µm
5.9 µin
0.453 in
11.5 mm
6 mm
0.236 in
Solder
Push-Pull
105 ░C
-55 °C
Gold
Unshrouded
Square
0.1 in
2.54 mm
Gold
0.098 in
2.5 mm
All
Male Pin
Through Hole
1
0.15 µm
5.9 µin
0.118 in
3 mm
Black

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 0.37
10$ 0.28
100$ 0.22
500$ 0.18
1000$ 0.17
5000$ 0.14
10000$ 0.13

Description

General part information

XG8V Series

Connector Header Through Hole 3 position 0.100" (2.54mm)

Documents

Technical documentation and resources