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70-1709-0820 - Kester_R500_Solder_Paste

70-1709-0820

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Kester Solder

SOLDER PASTE WATER SOLUBLE 35GM

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70-1709-0820 - Kester_R500_Solder_Paste

70-1709-0820

Active
Kester Solder

SOLDER PASTE WATER SOLUBLE 35GM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification70-1709-0820
CompositionSn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Flux TypeWater Soluble
Form35 g
Form1.23 oz
Form10 cc
FormSyringe
Melting Point [Max]218 °C
Melting Point [Max]424 °F
Melting Point [Min]217 °C
Melting Point [Min]423 °F
Mesh Type3
Shelf Life6 Months
Shelf Life StartDate of Manufacture
Shipping InfoShips with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature [Max]50 °F
Storage/Refrigeration Temperature [Max]10 °C
Storage/Refrigeration Temperature [Min]0 °C
Storage/Refrigeration Temperature [Min]0 °C
TypeSolder Paste

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 62.77
5$ 54.05
10$ 50.66
25$ 46.50
50$ 43.57
100$ 40.82

Description

General part information

70-1709 Series

Lead Free Water Soluble Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Syringe, 1.23 oz (35g), 10cc

Documents

Technical documentation and resources