WB75FC65ALZ

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WeEn Semiconductors Co., Ltd

WB75FC65AL/NAU000/NO MARK*CHIPS

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WeEn Semiconductors Co., Ltd

WB75FC65AL/NAU000/NO MARK*CHIPS

Technical Specifications

Parameters and characteristics for this part

Specification	WB75FC65ALZ

Current - Average Rectified (Io)	75 A
Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	175 °C
Package / Case	Die
Reverse Recovery Time (trr)	50 ns
Speed	200 mA, 500 ns
Supplier Device Package	Wafer
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	650 V
Voltage - Forward (Vf) (Max) @ If	2.75 V

Part	Voltage - Forward (Vf) (Max) @ If	Voltage - DC Reverse (Vr) (Max) [Max]	Current - Average Rectified (Io)	Speed	Supplier Device Package	Operating Temperature - Junction	Current - Reverse Leakage @ Vr	Package / Case	Reverse Recovery Time (trr)	Technology	Mounting Type
WeEn Semiconductors Co., Ltd WB75FC65ALZ	2.75 V	650 V	75 A	200 mA 500 ns	Wafer	175 °C	10 µA	Die	50 ns	Standard	Surface Mount
WeEn Semiconductors Co., Ltd WB75FC120ALZ	3.3 V	1.2 kV	75 A	200 mA 500 ns	Wafer	175 °C	250 µA	Die	85 ns	Standard	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	426	$ 1.13

General part information

Diode 650 V 75A Surface Mount Wafer

Technical documentation and resources

No documents available