BDN18-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.81"SQ

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.81"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN18-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length	1.81 "
Length	45.97 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	3.5 °C/W, 400 LFM
Thermal Resistance @ Natural	10.8 °C/W
Type	Top Mount
Width [x]	45.97 mm
Width [x]	1.81 in

Part	Thermal Resistance @ Natural	Type	Package Cooled	Thermal Resistance @ Forced Air Flow	Shelf Life	Material Finish	Length	Length	Shape	Attachment Method	Width [x]	Width [x]	Material	Fin Height [z]	Fin Height [z]	Fin Height	Fin Height
Tusonix a Subsidiary of CTS Electronic Components BDN18-6CB/A01	8.1 °C/W	Top Mount	ASIC BGA CPU LGA	2.8 °C/W 400 LFM	24 Months	Black Anodized	1.81 "	45.97 mm	Pin Fins Square	Thermal Tape Adhesive (Included)	45.97 mm	1.81 in	Aluminum	15.37 mm	0.605 in
Tusonix a Subsidiary of CTS Electronic Components BDN18-3CB/A01	10.8 °C/W	Top Mount	ASIC BGA CPU LGA	3.5 °C/W 400 LFM	24 Months	Black Anodized	1.81 "	45.97 mm	Pin Fins Square	Thermal Tape Adhesive (Included)	45.97 mm	1.81 in	Aluminum			9.02 mm	0.355 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources