SIP41430-001LF

Obsolete

Amphenol ICC (FCI)

CONN SOCKET SIP 2POS TIN

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Obsolete

Amphenol ICC (FCI)

CONN SOCKET SIP 2POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	SIP41430-001LF

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Features	Closed Frame
Housing Material	Polyamide (PA), Nylon
Mounting Type	Surface Mount
Number of Positions or Pins (Grid) [custom]	1 x 2
Number of Positions or Pins (Grid) [custom]	2
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

Part	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Material - Mating	Contact Material - Post	Mounting Type
Amphenol ICC (FCI) SIP41430-001LF	1 x 2	2	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	0.1 in	2.54 mm	Tin	SIP	Solder	200 µin	5.08 µm	Polyamide (PA) Nylon	Beryllium Copper	Beryllium Copper	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

2 (1 x 2) Pos SIP Socket Tin Surface Mount

Technical documentation and resources