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V9MLA0603NT - Littelfuse_Fuse_MLE

V9MLA0603NT

Active
Littelfuse/Commercial Vehicle Products

VAR MLV 6.5VAC/9VDC 30A 16V 0603 SMD T/R

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V9MLA0603NT - Littelfuse_Fuse_MLE

V9MLA0603NT

Active
Littelfuse/Commercial Vehicle Products

VAR MLV 6.5VAC/9VDC 30A 16V 0603 SMD T/R

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationV9MLA0603NT
Capacitance @ Frequency490 pF
Current - Surge30 A
Energy0.1 J
Maximum AC Volts [Max]6.5 V
Maximum DC Volts [Max]9 V
Mounting TypeSurface Mount, MLCV
Number of Circuits1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case0603 (1608 Metric)
Varistor Voltage (Max) [Max]16 V
Varistor Voltage (Min) [Min]11 V
Varistor Voltage (Typ)13.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.44
10$ 0.38
25$ 0.35
100$ 0.28
250$ 0.26
500$ 0.22
1000$ 0.17
2500$ 0.16
5000$ 0.15
Digi-Reel® 1$ 0.44
10$ 0.38
25$ 0.35
100$ 0.28
250$ 0.26
500$ 0.22
1000$ 0.17
2500$ 0.16
5000$ 0.15
Tape & Reel (TR) 10000$ 0.14

Description

General part information

V9MLA0603 Series

The MLA Series family of Transient Voltage Surge Suppression devices is based on the Littelfuse Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including those specified in IEC 6100-4-2 or other standards used for Electromagnetic Compliance (EMC). The ML Series is typically applied to protect integrated circuits and other components at the circuit board level. The wide operating voltage and energy range make the MLA Series suitable for numerous applications on power supply, control and signal lines. The MLA Series is manufactured from semiconducting ceramics, and is supplied in a leadless, surface mount package. The ML Series is compatible with modern reflow and wave soldering procedures. It can operate over a wider temperature range than zener diodes, and has a much smaller footprint than plastic-housed components.