28-3518-111

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Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

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28-3518-111

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Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	28-3518-111

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

28-3518 Series

Part	Number of Positions or Pins (Grid)	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Material - Mating	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Type	Type	Type	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Contact Finish - Mating	Current Rating (Amps)	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features
Aries Electronics 28-3518-10	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Tin	0.3 "	7.62 mm	DIP	Through Hole	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame
Aries Electronics 28-3518-10H	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Tin	0.3 "	7.62 mm	DIP	Through Hole	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame
Aries Electronics 28-3518-10TLH	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Tin	0.3 "	7.62 mm	DIP	Through Hole	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame
Aries Electronics 28-3518-111	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Gold	0.3 "	7.62 mm	DIP	Through Hole	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame
Aries Electronics 28-3518-11H	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Gold	0.3 "	7.62 mm	DIP	Through Hole	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame
Aries Electronics 28-3518-10T	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Tin	0.3 "	7.62 mm	DIP	Through Hole	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame
Aries Electronics 28-3518-101	28	UL94 V-0	2.54 mm	0.1 in	Beryllium Copper	Solder	0.1 in	2.54 mm	Tin	0.3 "	7.62 mm	DIP	Through Hole	200 µin	5.08 µm	3.18 mm	0.125 in	Brass	Gold	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Open Frame

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	69	$ 7.00

Description

General part information

28-3518 Series

28 (2 x 14) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources