W66BP2NQUAFJ

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Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200TFBGA

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Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200TFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Mounting Type	Write Cycle Time - Word, Page	Operating Temperature [Max]	Operating Temperature [Min]	Memory Organization	Package / Case	Voltage - Supply [Min]	Voltage - Supply [Max]	Clock Frequency	Memory Format	Memory Size	Memory Type	Technology	Supplier Device Package [y]	Supplier Device Package [x]	Supplier Device Package	Access Time
Winbond Electronics W66BP2NQQAHJ	Surface Mount	18 ns	105 °C	-40 °C	64M x 32	200-TFBGA	1.06 V 1.7 V	1.17 V 1.95 V	2.133 GHz	DRAM	2 Gbit	Volatile	SDRAM - Mobile LPDDR4	14.5	10	200-TFBGA	3.6 ns
Winbond Electronics W66BP2NQUAFJ	Surface Mount	18 ns	105 °C	-40 °C	64M x 32	200-TFBGA	1.06 V 1.7 V	1.17 V 1.95 V	1.6 GHz	DRAM	2 Gbit	Volatile	SDRAM - Mobile LPDDR4	14.5	10	200-TFBGA	3.6 ns

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	144	$ 4.41

General part information

SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 1.6 GHz 3.6 ns 200-TFBGA (10x14.5)

Technical documentation and resources

No documents available