35-0518-11

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Aries Electronics

CONN SOCKET SIP 35POS GOLD

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35-0518-11

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Aries Electronics

CONN SOCKET SIP 35POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	35-0518-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	35
Number of Positions or Pins (Grid) [custom]	1
Number of Positions or Pins (Grid) [custom]	35
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	SIP

35-0518 Series

Part	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Type	Features	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Mounting Type	Housing Material	Contact Material - Mating	Material Flammability Rating	Termination Post Length [x]	Termination Post Length [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Termination Post Length	Termination Post Length
Aries Electronics 35-0518-00	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Surface Mount	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0	0.046 in	1.17 mm	200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder
Aries Electronics 35-0518-11	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Gold	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			10 çin	0.25 çm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-10	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-10T	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-11H	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Gold	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			10 çin	0.25 çm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-10H	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	95	$ 5.09

Description

General part information

35-0518 Series

35 (1 x 35) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources