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SP8K80TB1 - Product schematic image

SP8K80TB1

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Rohm Semiconductor

MOSFET 2N-CH 500V 0.5A 8SOP

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SP8K80TB1 - Product schematic image

SP8K80TB1

Active
Rohm Semiconductor

MOSFET 2N-CH 500V 0.5A 8SOP

Technical Specifications

Parameters and characteristics for this part

SpecificationSP8K80TB1
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C500 mA
Drain to Source Voltage (Vdss)500 V
Gate Charge (Qg) (Max) @ Vgs3.8 nC
Input Capacitance (Ciss) (Max) @ Vds23.5 pF
Mounting TypeSurface Mount
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs11.7 Ohm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.72
10$ 1.76
100$ 1.21
500$ 0.97
1000$ 0.89
Digi-Reel® 1$ 2.72
10$ 1.76
100$ 1.21
500$ 0.97
1000$ 0.89
Tape & Reel (TR) 2500$ 0.79

Description

General part information

SP8K80 Series

Complex type MOSFETs(N+N) are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

About Export Regulations

Export Information

SP8K80 Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Explanation for Marking

Package Information

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Constitution Materials List

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Inner Structure

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Transistor)

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Part Explanation

Application Note

How to Create Symbols for PSpice Models

Models

ESD Data

Characteristics Data