42-3553-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 42POS GLD
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42-3553-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 42POS GLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 42-3553-11 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 42 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP, ZIF (ZIP) |
42-3553 Series
| Part | Type | Type | Type | Contact Finish - Mating | Contact Material - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Features | Housing Material | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Contact Material - Post | Mounting Type | Contact Finish - Post | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | Beryllium Copper | UL94 V-0 | 2.54 mm | 0.1 in | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 1 A | 0.1 in | 2.54 mm | 42 | Beryllium Copper | Through Hole | Gold | Solder | ||||
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Copper | UL94 V-0 | 2.54 mm | 0.1 in | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 1 A | 0.1 in | 2.54 mm | 42 | Beryllium Copper | Through Hole | Tin | Solder | 200 µin | 5.08 µm | 5.08 µm | 200 µin | |
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Nickel Boron | Beryllium Copper | UL94 V-0 | 2.54 mm | 0.1 in | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 1 A | 0.1 in | 2.54 mm | 42 | Beryllium Copper | Through Hole | Nickel Boron | Solder | 50 µin | 1.27 µm | 1.27 µm | 50 µin |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 21 | $ 26.41 | |
Description
General part information
42-3553 Series
42 (2 x 21) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources