APA-318-G-C

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Samtec Inc.

CONN DIP ADAPTER HDR 18 POS 2.54MM ST THRU-HOLE BULK

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APA-318-G-C

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Samtec Inc.

CONN DIP ADAPTER HDR 18 POS 2.54MM ST THRU-HOLE BULK

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	APA-318-G-C

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	20 µin
Contact Finish Thickness - Post	0.51 µm
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Features	Open Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	18
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder

APA-318 Series

Part	Housing Material	Mounting Type	Number of Positions or Pins (Grid)	Termination	Material Flammability Rating	Pitch - Post	Pitch - Post	Features	Pitch - Mating	Pitch - Mating	Contact Material - Post	Contact Finish - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. APA-318-T-M	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze
Samtec Inc. APA-318-G-B	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	0.51 µm	20 µin	Gold	20 µin	0.51 µm
Samtec Inc. APA-318-T-A1	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze
Samtec Inc. APA-318-G-C	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	0.51 µm	20 µin	Gold	20 µin	0.51 µm
Samtec Inc. APA-318-T-P	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze
Samtec Inc. APA-318-G-A	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	0.51 µm	20 µin	Gold	20 µin	0.51 µm
Samtec Inc. APA-318-T-A	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze
Samtec Inc. APA-318-G-P	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	0.51 µm	20 µin	Gold	20 µin	0.51 µm
Samtec Inc. APA-318-G-M	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	0.51 µm	20 µin	Gold	20 µin	0.51 µm
Samtec Inc. APA-318-G-J	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	18	Solder	UL94 V-0	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	0.51 µm	20 µin	Gold	20 µin	0.51 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 11.87

Description

General part information

APA-318 Series

18 (2 x 9) Pos Socket Gold Through Hole

Documents

Technical documentation and resources