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70-0605-0910 - 70-0605-0810

70-0605-0910

Active
Kester Solder

SOLDER PASTE NO CLEAN 500GM

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70-0605-0910 - 70-0605-0810

70-0605-0910

Active
Kester Solder

SOLDER PASTE NO CLEAN 500GM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification70-0605-0910
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Flux TypeNo-Clean
FormJar
Form17.64 oz, 500 g
Melting Point [Max]218 °C
Melting Point [Max]424 °F
Melting Point [Min]217 °C
Melting Point [Min]423 °F
Mesh Type [custom]4
Shelf Life4 Months
Shelf Life StartDate of Manufacture
Shipping InfoShips with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature [Max]50 °F
Storage/Refrigeration Temperature [Max]10 °C
Storage/Refrigeration Temperature [Min]0 °C
Storage/Refrigeration Temperature [Min]0 °C
TypeSolder Paste

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 10$ 191.88

Description

General part information

70-0605 Series

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Documents

Technical documentation and resources