1823-25F

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Techspray

DESOLDERING BRAID, NO-CLEAN SERIES, BLUE, FLUX COATED COPPER, 2.5 MM WIDTH, 25 FT LENGTH

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DocumentsTechnical Data Sheet EN

1823-25F

Active

Techspray

DESOLDERING BRAID, NO-CLEAN SERIES, BLUE, FLUX COATED COPPER, 2.5 MM WIDTH, 25 FT LENGTH

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DocumentsTechnical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	1823-25F

Color	Blue
ESD Protection	Static Dissipative (SD)
Length	25 ft
Length	7.62 m
Product Type	Braid/Wick
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Type	No Clean
Width [x]	0.098 in
Width [x]	2.5 mm

1823 Series

Part	Color	ESD Protection	Width [x]	Width [x]	Shelf Life Start	Shelf Life	Product Type	Type	Length	Length	Length [x]	Length [x]
Techspray 1823-25F	Blue	Static Dissipative (SD)	0.098 in	2.5 mm	Date of Manufacture	24 Months	Braid/Wick	No Clean	25 ft	7.62 m
Techspray 1823-100F	Blue	Static Dissipative (SD)	0.098 in	2.5 mm	Date of Manufacture	24 Months	Braid/Wick	No Clean		30.5 m	100 ft
Techspray 1823-10F	Blue	Static Dissipative (SD)	0.098 in	2.5 mm	Date of Manufacture	24 Months	Braid/Wick	No Clean			10 ft	3.048 m
Techspray 1823-5F	Blue	Static Dissipative (SD)	0.098 in	2.5 mm	Date of Manufacture	24 Months	Braid/Wick	No Clean	5 '	152.4 cm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 23.80
Newark	Each	1	$ 25.63

Description

General part information

1823 Series

The 1823-25F from Techspray is a 25ft long No-Clean blue #4 desoldering braid. Desoldering braid is a pre-fluxed copper braid that is used to remove solder which allows components to be replaced and excess solder to be removed. NoClean desoldering braid (wick) does not leave behind ionic flux residues that can collect and form branches called "dendrites". Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of your products. Available in anti-static spool to prevent static build-up from damaging sensitive components. Meets or exceeds MIL-F-14256, NASA NHB 5300, 4 (34-1), NASA NPC 200-4, NASA SP5002, 1821:HP 8690-0588, 1823: HP 8690-0577, IPC Standard-J-STD-004.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet