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WBNCSAC32 - WBNCSAC32

WBNCSAC32

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SRA Soldering Products

LEAD FREE NO-CLEAN FLUX CORE SIL

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WBNCSAC32 - WBNCSAC32

WBNCSAC32

Active
SRA Soldering Products

LEAD FREE NO-CLEAN FLUX CORE SIL

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationWBNCSAC32
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter [diameter]0.81 mm
Diameter [diameter]0.032 in
Flux TypeNo-Clean
FormSpool, 1 lb (454 g)
Melting Point [custom]221 °C
Melting Point [custom]430 °F
TypeWire Solder
Wire Gauge20 AWG, 21 SWG

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeySpool 1$ 95.99

Description

General part information

WBNCSA Series

Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 21 SWG Spool, 1 lb (454 g)

Documents

Technical documentation and resources