
WBNCSAC32
ActiveSRA Soldering Products
LEAD FREE NO-CLEAN FLUX CORE SIL
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WBNCSAC32
ActiveSRA Soldering Products
LEAD FREE NO-CLEAN FLUX CORE SIL
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | WBNCSAC32 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter [diameter] | 0.81 mm |
| Diameter [diameter] | 0.032 in |
| Flux Type | No-Clean |
| Form | Spool, 1 lb (454 g) |
| Melting Point [custom] | 221 °C |
| Melting Point [custom] | 430 °F |
| Type | Wire Solder |
| Wire Gauge | 20 AWG, 21 SWG |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Spool | 1 | $ 95.99 | |
Description
General part information
WBNCSA Series
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 21 SWG Spool, 1 lb (454 g)
Documents
Technical documentation and resources