PH3N-50.8-12.7-0.07-1A

Obsolete

t-Global Technology

PH3N NANO 50.8X12.70X0.07MM

Search across all available documentation for this part.

Obsolete

t-Global Technology

PH3N NANO 50.8X12.70X0.07MM

Technical Specifications

Parameters and characteristics for this part

Part	Shape	Fin Height [z]	Fin Height [z]	Material	Shelf Life	Type	Length	Length	Package Cooled	Attachment Method	Material Finish	Fin Height	Fin Height
t-Global Technology PH3N-50.8-12.7-0.07-1A	Rectangular	0.003 in	0.07 mm	Copper	12 Months	Heat Spreader	50.8 mm	2 in	ASIC BGA CPU LGA	Adhesive	Polyester
t-Global Technology PH3N-50.8-12.7-0.062-1A	Rectangular			Copper	12 Months	Heat Spreader	50.8 mm	2 in	ASIC BGA CPU LGA	Adhesive	Polyester	0.002 in	0.06 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader

Technical documentation and resources