XL210-512-FB236-C20

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XMOS

IC MCU 32BIT ROMLESS 236FBGA

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Active

XMOS

IC MCU 32BIT ROMLESS 236FBGA

Technical Specifications

Parameters and characteristics for this part

Part	Package / Case	Core Processor	RAM Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Speed	Oscillator Type	Mounting Type	Number of I/O	Program Memory Type	Operating Temperature [Max]	Operating Temperature [Min]	Core Size	Supplier Device Package
XMOS XL210-256-TQ128-I20	128-TQFP Exposed Pad	XCore	256 K	3.6 V	0.95 V	2000 MIPS	External	Surface Mount	88	ROMless	85 °C	-40 °C	10 Core 32 Bit
XMOS XL210-512-TQ128-C20	128-TQFP Exposed Pad	XCore	512 K	3.6 V	0.95 V	2000 MIPS	External	Surface Mount	88	ROMless	70 °C	0 °C	10 Core 32 Bit
XMOS XL210-512-FB236-C20	236-LFBGA	XCore	512 K	3.6 V	0.95 V	2000 MIPS	External	Surface Mount	128	ROMless	70 °C	0 °C	10 Core 32 Bit	236-FBGA (10x10)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	168	$ 13.35

General part information

XCore XL Microcontroller IC 32-Bit 10-Core 2000MIPS ROMless 236-FBGA (10x10)

Technical documentation and resources