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235-3019-02-0602 - 3M 235-3019-02-0602

235-3019-02-0602

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3M (TC)

IC & COMPONENT SOCKET, 35 CONTACTS, PCB SOCKET, 1.27 MM, 235 SERIES, BERYLLIUM COPPER

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235-3019-02-0602 - 3M 235-3019-02-0602

235-3019-02-0602

Active
3M (TC)

IC & COMPONENT SOCKET, 35 CONTACTS, PCB SOCKET, 1.27 MM, 235 SERIES, BERYLLIUM COPPER

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification235-3019-02-0602
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post30 µin
Contact Finish Thickness - Post0.76 µm
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
Contact Resistance25 mOhm
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolysulfone (PSU), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)35
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.05 in
Pitch - Mating1.27 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.192 in
Termination Post Length4.9 mm
TypeZIF (ZIP), Zig-Zag

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 10$ 93.04

Description

General part information

235 Series

35 (1 x 17, 1 x 18) Pos Zig-Zag, ZIF (ZIP) Socket Gold Through Hole

Documents

Technical documentation and resources