14-8510-610C

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Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	14-8510-610C

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame, Elevated
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	14
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Housing Material	Type	Type	Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Termination	Current Rating (Amps)	Features	Contact Finish - Post	Contact Material - Mating	Termination Post Length	Termination Post Length	Mounting Type	Contact Material - Post	Contact Finish - Mating	Contact Material - Post [custom]
Aries Electronics 14-8510-10WR	2.54 mm	0.1 in	14	Glass Filled Nylon 4/6 Polyamide (PA46)	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	200 µin	5.08 µm	0.1 in	2.54 mm	5.08 µm	200 µin	UL94 V-0	Solder	1 A	Closed Frame Elevated	Tin	Phosphor Bronze	3.56 mm	0.14 in	Through Hole	Phosphor Bronze
Aries Electronics 14-8510-610C	2.54 mm	0.1 in	14	Glass Filled Nylon 4/6 Polyamide (PA46)	0.6 in	15.24 mm	DIP	105 ░C	-55 °C	10 çin	0.25 çm	0.1 in	2.54 mm	0.76 Ám	30 Áin	UL94 V-0	Solder	3 A	Closed Frame Elevated	Gold	Beryllium Copper	3.56 mm	0.14 in	Through Hole		Gold	Brass
Aries Electronics 14-8510-310C	2.54 mm	0.1 in	14	Glass Filled Nylon 4/6 Polyamide (PA46)	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	10 çin	0.25 çm	0.1 in	2.54 mm	0.76 Ám	30 Áin	UL94 V-0	Solder	3 A	Closed Frame Elevated	Gold	Beryllium Copper	3.56 mm	0.14 in	Through Hole		Gold	Brass

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	50	$ 7.61

General part information

14 (2 x 7) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources