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W63CH2MBVACE

Obsolete
Winbond Electronics

IC DRAM 4GBIT PAR 178VFBGA

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W63CH2MBVACE

Obsolete
Winbond Electronics

IC DRAM 4GBIT PAR 178VFBGA

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationW63CH2MBVACE
Clock Frequency933 MHz
Memory FormatDRAM
Memory InterfaceParallel
Memory Organization128 M
Memory Size512 kb
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-25 °C
Package / Case178-VFBGA
Supplier Device Package178-VFBGA
Supplier Device Package [x]11
Supplier Device Package [y]11.5
TechnologySDRAM - Mobile LPDDR3
Voltage - Supply [Max]1.95 V, 1.3 V
Voltage - Supply [Min]1.7 V, 1.14 V
Write Cycle Time - Word, Page15 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

W63CH2 Series

SDRAM - Mobile LPDDR3 Memory IC 4Gbit Parallel 933 MHz 178-VFBGA (11x11.5)

Documents

Technical documentation and resources