STK554U392C-E

Obsolete

ON Semiconductor

INTELLIGENT POWER MODULE (IPM), 600 V, 15 A

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DocumentsDatasheet Package Drawing-127EZ-SIP29 62x21.8FP−1 +1

STK554U392C-E

Obsolete

ON Semiconductor

INTELLIGENT POWER MODULE (IPM), 600 V, 15 A

Deep-Dive with AI

DocumentsDatasheet Package Drawing-127EZ-SIP29 62x21.8FP−1 +1

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	STK554U392C-E

Configuration	3 Phase Inverter
Current	15 A
Mounting Type	Through Hole
Package / Case	29-SSIP Module, 21 Leads, Formed Leads
Type	IGBT
Voltage	600 V

STK554U392C-E Series

Intelligent Power Module (IPM), 600 V, 15 A

Part	Current - Peak Output	Features	Applications	Fault Protection	Output Configuration	Interface	Mounting Type	Voltage - Load [Max]	Supplier Device Package	Package / Case	Current - Output / Channel [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Load Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Technology	Configuration	Type	Current	Voltage	Function	Utilized IC / Part	Supplied Contents	Contents
ON Semiconductor STK554U392A-E	30 A	Bootstrap Circuit Status Flag	AC Motors	Current Limiting Shoot-Through UVLO	Half Bridge (3)	Logic	Through Hole	450 V	29-SIP	29-SSIP Module 21 Leads Formed Leads	15 A	150 °C	-40 °C	Inductive	12.5 V	17.5 V	IGBT
ON Semiconductor STK554U392C-E							Through Hole			29-SSIP Module 21 Leads Formed Leads								3 Phase Inverter	IGBT	15 A	600 V
ON Semiconductor STK554U392AGEVB																			Power Management			Motor Controller/Driver	STK554U392A	Board(s)
ON Semiconductor STK554U3A1A-E
ON Semiconductor STK554U362AGEVB																			Power Management			Motor Controller/Driver	STK554U362A		Board(s)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

STK554U392C-E Series

This Intelligent Power Module (IPM) is a highly integrated device containing all High Voltage (HV) control from HV-DC to 3-phase outputs in a single small SIP module. Output stage uses IGBT/FRD technology and implements Under Voltage Protection (UVP) and Over Current Protection (OCP) with a Fault Detection output flag. Internal Boost diodes are provided for high side gate boost drive.