32-6573-10
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 32POS TIN
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32-6573-10
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 32POS TIN
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 32-6573-10 |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) [custom] | 2 x 16 |
| Number of Positions or Pins (Grid) [custom] | 32 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 15.24 mm |
| Type | DIP, ZIF (ZIP) |
| Type | 0.6 " |
32-6573 Series
| Part | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Type | Type | Type | Contact Material - Post | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Material Flammability Rating | Termination | Contact Material - Mating | Pitch - Post | Pitch - Post | Housing Material | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | 0.11 in | 2.78 mm | 2 x 16 | 32 | 1 A | UL94 V-0 | Solder | Beryllium Copper | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole |
Aries Electronics | Closed Frame | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | 0.11 in | 2.78 mm | 2 x 16 | 32 | 1 A | UL94 V-0 | Solder | Beryllium Copper | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 32 | $ 16.08 | |
Description
General part information
32-6573 Series
32 (2 x 16) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Documents
Technical documentation and resources