ACA-SPI-006-K01
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SPI 16 PIN_IC 300MIL
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ACA-SPI-006-K01
ActiveLOTES
SPI 16 PIN_IC 300MIL
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | ACA-SPI-006-K01 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 1 µin |
| Contact Finish Thickness - Mating | 0.025 µm |
| Contact Finish Thickness - Post | 1 µin |
| Contact Finish Thickness - Post | 0.025 µm |
| Contact Material - Mating | Phosphor Bronze |
| Contact Material - Post | Phosphor Bronze |
| Contact Resistance | 30 mOhm |
| Features | Closed Frame, Board Guide |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 16 |
| Pitch - Mating | 0.05 in |
| Pitch - Mating | 1.27 mm |
| Pitch - Post | 1.27 mm |
| Pitch - Post | 0.05 in |
| Termination | Solder |
| Type | SOIC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
ACA-SPI-006-K01
16 (2 x 8) Pos SOIC Socket Gold Surface Mount
Documents
Technical documentation and resources