LOTES

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Part	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Material - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Post	Material Flammability Rating	Type	Contact Resistance	Housing Material	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Mating
LOTES ACA-SPI-004-K01	1.27 mm	0.05 in	Gold	Phosphor Bronze	Gold	1 µin	0.025 µm	Board Guide Closed Frame	0.05 in	1.27 mm	Surface Mount	Phosphor Bronze	UL94 V-0	SOIC	30 mOhm	Liquid Crystal Polymer (LCP)	Solder	1 µin	0.025 µm	8
LOTES ACA-SPI-006-K01	1.27 mm	0.05 in	Gold	Phosphor Bronze	Gold	1 µin	0.025 µm	Board Guide Closed Frame	0.05 in	1.27 mm	Surface Mount	Phosphor Bronze	UL94 V-0	SOIC	30 mOhm	Liquid Crystal Polymer (LCP)	Solder	1 µin	0.025 µm	16
LOTES ASPI0001-P001A	1.27 mm	0.05 in	Gold	Phosphor Bronze	Gold	1 µin	0.025 µm	Board Guide Closed Frame	0.05 in	1.27 mm	Surface Mount	Phosphor Bronze	UL94 V-0	SOIC	30 mOhm	Liquid Crystal Polymer (LCP)	Solder	1 µin	0.025 µm	8
LOTES ASPI0002-P001A	1.27 mm	0.05 in	Gold	Phosphor Bronze	Gold			Board Guide Closed Frame	0.05 in	1.27 mm	Surface Mount	Phosphor Bronze	UL94 V-0	SOIC	30 mOhm	Liquid Crystal Polymer (LCP)	Solder		0.38 µm	8	Flash	15 µin