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V5.5MLA020133NR - LITTELFUSE V5.5MLA020147NR

V5.5MLA020133NR

Active
Littelfuse/Commercial Vehicle Products

TVS VARISTOR, 4 V, 5.5 V, MLA SERIES, 28 V, 0201 [0603 METRIC], MULTILAYER VARISTOR (MLV)

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V5.5MLA020133NR - LITTELFUSE V5.5MLA020147NR

V5.5MLA020133NR

Active
Littelfuse/Commercial Vehicle Products

TVS VARISTOR, 4 V, 5.5 V, MLA SERIES, 28 V, 0201 [0603 METRIC], MULTILAYER VARISTOR (MLV)

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Technical Specifications

Parameters and characteristics for this part

SpecificationV5.5MLA020133NR
Capacitance @ Frequency33 pF
Current - Surge1 A
Maximum AC Volts [Max]4 V
Maximum DC Volts [Max]5.5 V
Mounting TypeSurface Mount, MLCV
Number of Circuits1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case0603 Metric
Package / Case0201
Varistor Voltage (Max) [Max]14 V
Varistor Voltage (Min) [Min]8 V
Varistor Voltage (Typ)11 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 15000$ 0.09
NewarkEach (Supplied on Full Reel) 10000$ 0.11
20000$ 0.10
30000$ 0.09
50000$ 0.08

Description

General part information

V5.5MLA020133N Series

The MLA Series family of Transient Voltage Surge Suppression devices is based on the Littelfuse Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including those specified in IEC 6100-4-2 or other standards used for Electromagnetic Compliance (EMC). The ML Series is typically applied to protect integrated circuits and other components at the circuit board level. The wide operating voltage and energy range make the MLA Series suitable for numerous applications on power supply, control and signal lines. The MLA Series is manufactured from semiconducting ceramics, and is supplied in a leadless, surface mount package. The ML Series is compatible with modern reflow and wave soldering procedures. It can operate over a wider temperature range than zener diodes, and has a much smaller footprint than plastic-housed components.

Documents

Technical documentation and resources