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UMH3NTN - ONSEMI FDC6333C..

UMH3NTN

Active
Rohm Semiconductor

BIPOLAR PRE-BIASED / DIGITAL TRANSISTOR, DUAL, DUAL NPN, 50 V, 100 MA, 4.7 KOHM

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UMH3NTN - ONSEMI FDC6333C..

UMH3NTN

Active
Rohm Semiconductor

BIPOLAR PRE-BIASED / DIGITAL TRANSISTOR, DUAL, DUAL NPN, 50 V, 100 MA, 4.7 KOHM

Technical Specifications

Parameters and characteristics for this part

SpecificationUMH3NTN
Current - Collector (Ic) (Max) [Max]100 mA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / Case6-TSSOP, SC-88, SOT-363
Resistor - Base (R1)4.7 kOhms
Supplier Device PackageUMT6
Transistor Type2 NPN - Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.47
10$ 0.29
100$ 0.18
500$ 0.14
1000$ 0.12
Digi-Reel® 1$ 0.47
10$ 0.29
100$ 0.18
500$ 0.14
1000$ 0.12
Tape & Reel (TR) 3000$ 0.10
6000$ 0.09
9000$ 0.09
15000$ 0.08
21000$ 0.08
30000$ 0.08
75000$ 0.07
NewarkEach (Supplied on Cut Tape) 1$ 0.48
10$ 0.36
25$ 0.31
50$ 0.27
100$ 0.22
250$ 0.19
500$ 0.15
1000$ 0.12

Description

General part information

UMH3NFHA Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

Condition of Soldering / Land Pattern Reference

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Part Explanation

Application Note

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

Taping Information

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

ESD Data

Characteristics Data

Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Types and Features of Transistors

Application Note

UMH3N Data Sheet

Data Sheet

UMT6 Inner Structure

Related Document

UMT6 Part Marking

Related Document

Transistor, MOSFET Flammability

Related Document