W66AQ6NBQAHJ

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Winbond Electronics

IC DRAM 1GBIT LVSTL 200TFBGA

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Winbond Electronics

IC DRAM 1GBIT LVSTL 200TFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Memory Organization	Access Time	Clock Frequency	Memory Type	Mounting Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case	Memory Interface	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Technology	Supplier Device Package [x]	Supplier Device Package [y]	Supplier Device Package	Write Cycle Time - Word, Page
Winbond Electronics W66AQ6NBHAGJ TR	64 M	3.6 ns	1.867 GHz	Volatile	Surface Mount	1.06 V 1.7 V	1.17 V 1.95 V	100-VFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	7.5	100-VFBGA	18 ns
Winbond Electronics W66AQ6NBHAFJ TR	64 M	3.6 ns	1.6 GHz	Volatile	Surface Mount	1.06 V 1.7 V	1.17 V 1.95 V	100-VFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	7.5	100-VFBGA	18 ns
Winbond Electronics W66AQ6NBQAHJ	64 M	3.6 ns	2.133 GHz	Volatile	Surface Mount	1.06 V 1.7 V	1.17 V 1.95 V	200-TFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	14.5	200-TFBGA	18 ns
Winbond Electronics W66AQ6NBHAHJ	64 M	3.6 ns	2.133 GHz	Volatile	Surface Mount	1.06 V 1.7 V	1.17 V 1.95 V	100-VFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	7.5	100-VFBGA	18 ns
Winbond Electronics W66AQ6NBQAGJ	64 M	3.6 ns	1.867 GHz	Volatile	Surface Mount	1.06 V 1.7 V	1.17 V 1.95 V	200-TFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	14.5	200-TFBGA	18 ns

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	144	$ 3.52

General part information

SDRAM - Mobile LPDDR4X Memory IC 1Gbit LVSTL_06 2.133 GHz 3.6 ns 200-TFBGA (10x14.5)

Technical documentation and resources

No documents available