2SD2673TL

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Rohm Semiconductor

NPN, SOT-346T, 30V 3A, LOW VCE(SAT) TRANSISTOR

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DocumentsTechnical Data Sheet EN About Export Regulations +29

2SD2673TL

Active

Rohm Semiconductor

NPN, SOT-346T, 30V 3A, LOW VCE(SAT) TRANSISTOR

Deep-Dive with AI

DocumentsTechnical Data Sheet EN About Export Regulations +29

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2SD2673TL

Current - Collector (Ic) (Max) [Max]	3 A
Current - Collector Cutoff (Max) [Max]	100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	270
Frequency - Transition	200 MHz
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	SC-96
Power - Max [Max]	1 W
Supplier Device Package	TSMT3
Transistor Type	NPN
Vce Saturation (Max) @ Ib, Ic [Max]	250 mV
Voltage - Collector Emitter Breakdown (Max) [Max]	30 V

2SD2673 Series

NPN, SOT-346T, 30V 3A, Low VCE(sat) Transistor

Part	Transistor Type	Current - Collector Cutoff (Max) [Max]	Package / Case	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Supplier Device Package	Mounting Type	Vce Saturation (Max) @ Ib, Ic [Max]	Power - Max [Max]	Operating Temperature	Voltage - Collector Emitter Breakdown (Max) [Max]	Frequency - Transition	Current - Collector (Ic) (Max) [Max]
Rohm Semiconductor 2SD2673TL	NPN	100 nA	SC-96	270	TSMT3	Surface Mount	250 mV	1 W	150 °C	30 V	200 MHz	3 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.69
		10	$ 0.59
		100	$ 0.41
		500	$ 0.34
		1000	$ 0.29
	Digi-Reel®	1	$ 0.69
		10	$ 0.59
		100	$ 0.41
		500	$ 0.34
		1000	$ 0.29
	Tape & Reel (TR)	3000	$ 0.23
Newark	Each (Supplied on Cut Tape)	1	$ 0.54
		10	$ 0.54
		25	$ 0.50
		50	$ 0.46
		100	$ 0.42
		250	$ 0.37
		500	$ 0.32
		1000	$ 0.29

Description

General part information

2SD2673 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.