24-3570-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
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24-3570-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 24-3570-11 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 10 çin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP, ZIF (ZIP) |
24-3570 Series
| Part | Termination | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Current Rating (Amps) | Mounting Type | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | Gold | 0.11 in | 2.78 mm | Gold | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Copper | 24 | Closed Frame | 10 çin | 0.25 çm | UL94 V-0 | Beryllium Copper | 10 çin | 0.25 çm | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | Through Hole | 2.54 mm | 0.1 in |
Aries Electronics | Solder | Nickel Boron | 0.11 in | 2.78 mm | Nickel Boron | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Nickel | 24 | Closed Frame | 50 µin | 1.27 µm | UL94 V-0 | Beryllium Nickel | 50 µin | 1.27 µm | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | Through Hole | 2.54 mm | 0.1 in |
Aries Electronics | Solder | Tin | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Copper | 24 | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | Beryllium Copper | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | Through Hole | 2.54 mm | 0.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 22 | $ 21.99 | |
Description
General part information
24-3570 Series
24 (2 x 12) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources